The IQ Moulding project is about utilising the innovative potentials for quality-assured integration/re-moulding of smart electronics in plastics (IQ mouldings) as well as savings potentials for Austrian companies, especially SMBs by lowering the manufacturing costs of the related production methods.
The objective of the project is to advance the development of know-how in the network group for integration/re-moulding of electronics in plastic components close to practice especially for SMBs, so that these can master the increasing challenges of the rising complexity of components. By means of the new know-how, the SMBs can significantly improve their innovative power for the development/production of smart plastic/electronic components. This enables leveraging savings potentials in manufacturing costs through the application of new technologies/materials. One key element is to familiarise Austrian companies/SMBs in a manner closely related to practice with improved manufacturing methods for IQ (Quality-assured integration of Intelligence) mouldings and innovative new products.
Project consortium:
- Industrial Liaison Department Montanuniversität (Außeninstitut) Montanuniversität (project coordinator)
- Aspöck Systems GmbH
- Botest Printed Sensors GmbH,
- ekey biometric systems GmbH
- Haratech Manfred Haiberger
- JKU, Institute of Polymer Science
- KEBA AG
- PTM Kunstofftechnologie GmbH
- TAGnology RFID GmbH
Funding information:
COIN "Cooperation and Networks" Programme Line, 7th call for proposals
Project period: 24 months; from 10/2014 until 09/2016
Contact: DI Renate Reumüller